Influence of dusty micro-particles contamination on adhesive bond strength
Department of Material Science and Manufacturing Technology, Faculty of Engineering, Czech University of Life Science, Kamýcká 129, CZ-16521 Prague, Czech Republic; *Correspondence: email@example.com
A necessity for a bond creation is one of common attributes of production companies. An adhesive bonding technology is a method of a connecting. This method is suitable for workings with a single and serial production. Many research projects dealt with a preparation of adhesive bonds, degradation aspects etc. An area, which has not been properly investigated at present, is an influence of a contamination of the adhesive bonds by dusty micro-particles, e. g. from a ventilation of assembly shops, production hall etc. The research was focused on the evaluation of the influence of dusty micro-particles contamination of the two-component epoxy adhesive at the hardening process. The dusty micro-particles were gained from the filtering equipment used in a production hall. Sizes of gained dusty particles were analysed on sieves of dimensions 315 μm, 250 μm, 160 μm, 90 μm. Subsequently, these particles were added in various ratios into the mixture of the adhesive during its preparation. The adhesive bonds containing the dusty particles of the sizes 250 µm, 160 µm and 90 µm showed the fall of the adhesive bond strength. The adhesive bonds containing the dusty particles of the size 315 µm showed the mild increase of the adhesive bond strength. The failure area did not change owing to the contamination of the adhesive bond with the dusty particles.